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MC10H330 Quad Bus Driver/Receiver with 2-to-1 Output Multiplexers
Description
The MC10H330 is a Quad Bus Driver/Receiver with two-to-one output multiplexers. These multiplexers have a common select and output enable. When disabled, (OE = high) the bus outputs go to -2.0 V. Their output can be brought to a low state (VOL) by applying a high level to the receiver enable (RE = High). The parameters specified are with 25 W loading on the bus drivers and 50 W loads on the receivers.
Features
http://onsemi.com MARKING DIAGRAMS*
24 MC10H330L AWLYYWW CDIP-24 L SUFFIX CASE 758 1
* Propagation Delay, 1.5 ns Typical Data-to-Output * Improved Noise Margin 150 mV (Over Operating Voltage and * * *
Temperature Range) Voltage Compensated MECL 10KTM Compatible Pb-Free Packages are Available*
24 MC10H330P AWLYYWWG PDIP-24 P SUFFIX CASE 724 VCC0 YBUS ZBUS OE Y0 Y1 Z0 Z1 RE ZIN YIN VCC0 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package PLCC-28 P SUFFIX CASE 776 1
DIP PIN ASSIGNMENT
VCC XBUS WBUS VCC0 X1 X0 W1 W0 S WIN XIN VEE 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13
1 10H330G AWLYYWW
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D).
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
February, 2006 - Rev. 7
1
Publication Order Number: MC10H330/D
MC10H330
Table 1. MAXIMUM RATINGS
Symbol VEE VI Iout TA Tstg Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current - Continuous - Surge Characteristic Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C
Operating Temperature Range Storage Temperature Range - Plastic - Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (Note 1)
0 Symbol IE IinH Characteristic Power Supply Current Input Current High Pins 5-8, 17-20 Pins 16, 21 Pin 9 Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Min - - - - 0.5 -1.02 -1.95 -1.17 -1.95 Max 157 667 514 475 - -0.84 -1.63 -0.84 -1.48 Min - - - - 0.5 -0.98 -1.95 -1.13 -1.95 25 Max 143 417 321 297 - -0.81 -1.63 -0.81 -1.48 Min - - - - 0.3 -0.92 -1.95 -1.07 -1.95 75 Max 157 417 321 297 - -0.735 -1.60 -0.735 -1.45 mA Vdc Vdc Vdc Vdc Unit mA mA
IinL VOH VOL VIH VIL
1. Each MECL 10HTM series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Receiver outputs are terminated through a 50 W resistor to -2.0 Vdc. Bus outputs are terminated through a 25 W resistor to -2.0 Vdc.
Table 3. AC PARAMETERS
0 Symbol tpd Characteristic Propagation Delay Select-to-Input Data-to-Bus Output Select-to-Bus Output OE-to-Bus Output Bus-to-Input RE-to-Input Data-to-Receiver Input Rise Time Fall Time Min 1.8 0.5 1.0 0.8 0.8 0.5 1.3 0.5 0.5 Max 5.3 2.0 3.2 2.2 2.1 2.2 4.0 2.0 2.0 Min 1.8 0.5 1.0 0.8 0.8 0.5 1.3 0.5 0.5 25 Max 5.3 2.0 3.2 2.2 2.1 2.2 4.0 2.0 2.0 Min 1.8 0.5 1.0 0.8 0.8 0.5 1.3 0.5 0.5 75 Max 5.3 2.0 3.2 2.2 2.4 2.2 4.0 2.0 2.0 ns ns Unit ns
tr tf
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
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MC10H330
LOGIC DIAGRAM
OE S W0
21 9 8
VCC0 VCC VCC0 VCC0 VEE
= = = = =
PIN 24 PIN 1 PIN 13 PIN 4 PIN 12 3 WBUS
W1 WIN X0 X1 XIN Y0 Y1 YIN Z0 Z1 ZIN RE
7 10 6 5 11 20 19 14 18 22 17 15 16 ZBUS 23 YBUS 2 XBUS
MULTIPLEXER TRUTH TABLE
OE H L L S X L H WBus XBus YBus ZBus -2.0 V -2.0 V -2.0 V -2.0 V W0 X0 Y0 Z0 W1 X1 Y1 Z1 H L
RECEIVER TRUTH TABLE
RE Win L WBus Xin L XBus Yin L YBus Zin L ZBus
ORDERING INFORMATION
Device MC10H330FN MC10H330FNG MC10H330FNR2 MC10H330FNR2G MC10H330L MC10H330P MC10H330PG Package PLCC-28 PLCC-28 (Pb-Free) PLCC-28 PLCC-28 (Pb-Free) CDIP-24 PDIP-24 PDIP-24 (Pb-Free) Shipping 37 Units / Rail 37 Units / Rail 500 / Tape & Reel 500 / Tape & Reel 15 Unit / Rail 15 Unit / Rail 15 Unit / Rail
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MC10H330
PACKAGE DIMENSIONS
PLCC-28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
Y BRK D Z -L- -M- B 0.007 (0.180) U
M
T L-M
M
S
N
S S
-N-
0.007 (0.180)
T L-M
N
S
W
28 1
D
V
X VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R E G G1 0.010 (0.250)
S
0.007 (0.180) 0.007 (0.180)
M M
T L-M T L-M
S S
N N
S S
H
0.007 (0.180)
M
T L-M
S
N
S
C
K1 0.004 (0.100) -T- SEATING
PLANE
J
K F VIEW S 0.007 (0.180)
M
VIEW S T L-M
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10_ 0.410 0.430 0.040 ---
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10_ 10.42 10.92 1.02 ---
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MC10H330
PACKAGE DIMENSIONS
CDIP-24 L SUFFIX CERAMIC DIP PACKAGE CASE 758-02 ISSUE A
B
24 1 13 12
L
P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
-A- N C K G D 24 PL 0.25 (0.010) F
M
J
-T-
SEATING PLANE
DIM A B C D F G J K L N P
INCHES MIN MAX 1.240 1.285 0.285 0.305 0.160 0.200 0.015 0.021 0.045 0.062 0.100 BSC 0.008 0.013 0.100 0.165 0.300 0.310 0.020 0.050 0.360 0.400
MILLIMETERS MIN MAX 31.50 32.64 7.24 7.75 4.07 5.08 0.38 0.53 1.14 1.57 2.54 BSC 0.20 0.33 2.54 4.19 7.62 7.87 0.51 1.27 9.14 10.16
TA
M
-A-
24 1 13 12
PDIP-24 P SUFFIX PLASTIC DIP PACKAGE CASE 724-03 ISSUE D
-B- L C
NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K L M N INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K E G F D
24 PL
NOTE 1
N J
24 PL
M 0.25 (0.010)
M
TB
M
0.25 (0.010)
M
TA
M
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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MC10H330/D

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